Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9666520 | 3D stacked-chip package | Chen-Hua Yu, Ming-Fa Chen, Wen-Chih Chiou, Wen-Ching Tsai | 2017-05-30 |
WL
Wen-Sen Lu
Overall (2017): #200,423 of 506,227Top 40%
1
Patents 2017