Issued Patents 2011
Showing 1–25 of 37 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8080867 | Integrated circuit packaging system with stacked integrated circuit and method of manufacture thereof | Jairus Legaspi Pisigan, Henry Descalzo Bathan | 2011-12-20 |
| 8076184 | Semiconductor device and method of forming wafer-level multi-row etched leadframe with base leads and embedded semiconductor die | Emmanuel Espiritu, Henry Descalzo Bathan, Dioscoro A. Merilo | 2011-12-13 |
| 8072079 | Through hole vias at saw streets including protrusions or recesses for interconnection | Reza A. Pagaila, Lionel Chien Hui Tay, Byung Tai Do | 2011-12-06 |
| 8072047 | Integrated circuit package system with shield and tie bar | Lionel Chien Hui Tay, Henry Descalzo Bathan, Guruprasad Badakere Govindaiah | 2011-12-06 |
| 8067825 | Integrated circuit package system with multiple die | Abelardo Jr. Hadap Advincula, Henry Descalzo Bathan, Jairus Legaspi Pisigan | 2011-11-29 |
| 8062934 | Integrated circuit package system with ground bonds | Jeffrey D. Punzalan, Henry Descalzo Bathan | 2011-11-22 |
| 8043894 | Integrated circuit package system with redistribution layer | Lionel Chien Hui Tay, Henry Descalzo Bathan | 2011-10-25 |
| 8039947 | Integrated circuit package system with different mold locking features | Jeffrey D. Punzalan, Henry Descalzo Bathan | 2011-10-18 |
| 8039302 | Semiconductor package and method of forming similar structure for top and bottom bonding pads | Lionel Chien Hui Tay, Henry Descalzo Bathan | 2011-10-18 |
| 8035207 | Stackable integrated circuit package system with recess | Henry Descalzo Bathan, Jose Alvin Caparas, Lionel Chien Hui Tay | 2011-10-11 |
| 8021907 | Method and apparatus for thermally enhanced semiconductor package | Reza A. Pagaila, Byung Tai Do | 2011-09-20 |
| 8022539 | Integrated circuit packaging system with increased connectivity and method of manufacture thereof | Frederick R. Dahilig, Henry Descalzo Bathan, Lionel Chien Hui Tay | 2011-09-20 |
| 8022514 | Integrated circuit package system with leadfinger support | Henry Descalzo Bathan, Arnel Senosa Trasporto, Jeffrey D. Punzalan | 2011-09-20 |
| 8003443 | Non-leaded integrated circuit package system with multiple ground sites | Jeffrey D. Punzalan, Byung Tai Do, Henry Descalzo Bathan | 2011-08-23 |
| 7998790 | Integrated circuit packaging system with isolated pads and method of manufacture thereof | Henry Descalzo Bathan, Lionel Chien Hui Tay, Jose Alvin Caparas | 2011-08-16 |
| 7993939 | Integrated circuit package system with laminate base | Henry Descalzo Bathan, Arnel Senosa Trasporto, Jeffrey D. Punzalan | 2011-08-09 |
| 7994629 | Leadless integrated circuit packaging system and method of manufacture thereof | — | 2011-08-09 |
| 7977780 | Multi-layer package-on-package system | Lionel Chien Hui Tay, Jairus Legaspi Pisigan | 2011-07-12 |
| 7977579 | Multiple flip-chip integrated circuit package system | Henry Descalzo Bathan, Arnel Senosa Trasporto, Jeffrey D. Punzalan | 2011-07-12 |
| 7977778 | Integrated circuit package system with interference-fit feature | Henry Descalzo Bathan, Lionel Chien Hui Tay | 2011-07-12 |
| 7977779 | Mountable integrated circuit package-in-package system | Arnel Senosa Trasporto, Lionel Chien Hui Tay, Henry Descalzo Bathan | 2011-07-12 |
| 7977782 | Integrated circuit package system with dual connectivity | Jairus Legaspi Pisigan, Jose Alvin Caparas, Lionel Chien Hui Tay | 2011-07-12 |
| 7964450 | Wirebondless wafer level package with plated bumps and interconnects | Dioscoro A. Merilo, Lionel Chien Hui Tay, Jose Alvin Caparas | 2011-06-21 |
| 7960815 | Leadframe design for QFN package with top terminal leads | Henry Descalzo Bathan, Jose Alvin Caparas, Lionel Chien Hui Tay | 2011-06-14 |
| 7936053 | Integrated circuit package system with lead structures including a dummy tie bar | Jeffrey D. Punzalan, Henry Descalzo Bathan, Il Kwon Shim | 2011-05-03 |