Issued Patents 2011
Showing 26–37 of 37 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7932130 | Method for forming an etched recess package on package system | Henry Descalzo Bathan, Lionel Chien Hui Tay, Jairus Legaspi Pisigan | 2011-04-26 |
| 7919360 | Integrated circuit packaging system with circuitry stacking and method of manufacture thereof | Jose Alvin Caparas, Arnel Senosa Trasporto | 2011-04-05 |
| 7919850 | Integrated circuit packaging system with exposed terminal interconnects and method of manufacturing thereof | Arnel Senosa Trasporto, Lionel Chien Hui Tay, Abelardo Hadap Advincula | 2011-04-05 |
| 7919848 | Integrated circuit package system with multiple devices | Henry Descalzo Bathan, Abelardo Jr Hadap Advincula, Lionel Chien Hui Tay | 2011-04-05 |
| 7915724 | Integrated circuit packaging system with base structure device | Jong-Woo Ha, Koo Hong Lee, Soo Won Lee, Juhyun Park, Jeffrey D. Punzalan +2 more | 2011-03-29 |
| 7915716 | Integrated circuit package system with leadframe array | Jairus Legaspi Pisigan, Jeffrey D. Punzalan, Lionel Chien Hui Tay | 2011-03-29 |
| 7911067 | Semiconductor package system with die support pad | Dioscoro A. Merilo, Lionel Chien Hui Tay | 2011-03-22 |
| 7911040 | Integrated circuit package with improved connections | Lionel Chien Hui Tay, Henry Descalzo Bathan | 2011-03-22 |
| 7901996 | Integrated circuit package system with interconnection support and method of manufacture thereof | Henry Descalzo Bathan, Il Kwon Shim, Jeffrey D. Punzalan | 2011-03-08 |
| 7888181 | Method of forming a wafer level package with RDL interconnection over encapsulant between bump and semiconductor die | Lionel Chien Hui Tay, Henry Descalzo Bathan, Jeffrey D. Punzalan | 2011-02-15 |
| 7871863 | Integrated circuit package system with multiple molding | Jose Alvin Caparas, Arnel Senosa Trasporto, Jeffrey D. Punzalan | 2011-01-18 |
| 7868471 | Integrated circuit package-in-package system with leads | Arnel Senosa Trasporto, Jeffrey D. Punzalan, Abelardo Hadap Advincula | 2011-01-11 |