Issued Patents 2011
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8084356 | Methods of low-K dielectric and metal process integration | Arthur M. Howald | 2011-12-27 |
| 8069813 | Wafer electroless plating system and associated methods | William Thie, John M. Boyd, Fritz Redeker, John Parks, Tiruchirapalli Arunagiri +5 more | 2011-12-06 |
| 8053355 | Methods and systems for low interfacial oxide contact between barrier and copper metallization | Fritz Redeker, John M. Boyd, Hyungsuk Alexander Yoon, Shijian Li | 2011-11-08 |
| 8048283 | Method and apparatus for plating semiconductor wafers | Bob Maraschin, John M. Boyd, Fred C. Redeker, Carl Woods | 2011-11-01 |
| 8034409 | Methods, apparatuses, and systems for fabricating three dimensional integrated circuits | Shijian Li, Fritz Redeker | 2011-10-11 |
| 8026605 | Interconnect structure and method of manufacturing a damascene structure | John M. Boyd, Fritz Redeker, William Thie, Tiruchirapalli Arunagiri, Hyungsuk Alexander Yoon | 2011-09-27 |
| 7947157 | Apparatus and method for depositing and planarizing thin films of semiconductor wafers | Mike Ravkin, John M. Boyd, Fred C. Redeker, John M. de Larios | 2011-05-24 |
| 7884017 | Thermal methods for cleaning post-CMP wafers | Zhonghui Wang, Tiruchirapalli Arunagiri, Fritz Redeker, John M. Boyd, Mikhail Korolik +3 more | 2011-02-08 |
| 7875554 | Method for electroless depositing a material on a surface of a wafer | John M. Boyd, William Thie, Bob Maraschin, Fred C. Redeker, Joel M. Cook | 2011-01-25 |
| 7862693 | Apparatus for plating semiconductor wafers | Fred C. Redeker, John M. Boyd, Robert A. Maraschin, Carl Woods | 2011-01-04 |