JB

John M. Boyd

Lam Research: 9 patents #2 of 205Top 1%
📍 Woodlawn, CA: #1 of 9 inventorsTop 15%
Overall (2011): #4,591 of 364,097Top 2%
9
Patents 2011

Issued Patents 2011

Showing 1–9 of 9 patents

Patent #TitleCo-InventorsDate
8069813 Wafer electroless plating system and associated methods William Thie, Fritz Redeker, Yezdi Dordi, John Parks, Tiruchirapalli Arunagiri +5 more 2011-12-06
8053355 Methods and systems for low interfacial oxide contact between barrier and copper metallization Fritz Redeker, Yezdi Dordi, Hyungsuk Alexander Yoon, Shijian Li 2011-11-08
8048283 Method and apparatus for plating semiconductor wafers Yezdi Dordi, Bob Maraschin, Fred C. Redeker, Carl Woods 2011-11-01
8026605 Interconnect structure and method of manufacturing a damascene structure Yezdi Dordi, Fritz Redeker, William Thie, Tiruchirapalli Arunagiri, Hyungsuk Alexander Yoon 2011-09-27
7947157 Apparatus and method for depositing and planarizing thin films of semiconductor wafers Mike Ravkin, Yezdi Dordi, Fred C. Redeker, John M. de Larios 2011-05-24
7909934 Megasonic cleaning efficiency using auto-tuning of a RF generator at constant maximum efficiency Andras Kuthi, Michael G. R. Smith, Thomas W. Anderson, William Thie 2011-03-22
7884017 Thermal methods for cleaning post-CMP wafers Zhonghui Wang, Tiruchirapalli Arunagiri, Fritz Redeker, Yezdi Dordi, Mikhail Korolik +3 more 2011-02-08
7875554 Method for electroless depositing a material on a surface of a wafer Yezdi Dordi, William Thie, Bob Maraschin, Fred C. Redeker, Joel M. Cook 2011-01-25
7862693 Apparatus for plating semiconductor wafers Yezdi Dordi, Fred C. Redeker, Robert A. Maraschin, Carl Woods 2011-01-04