Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8069813 | Wafer electroless plating system and associated methods | William Thie, John M. Boyd, Fritz Redeker, Yezdi Dordi, Tiruchirapalli Arunagiri +5 more | 2011-12-06 |
| 7896974 | Chamber for wafer cleaning and method for making the same | — | 2011-03-01 |