Issued Patents 2011
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8069813 | Wafer electroless plating system and associated methods | John M. Boyd, Fritz Redeker, Yezdi Dordi, John Parks, Tiruchirapalli Arunagiri +5 more | 2011-12-06 |
| 8026605 | Interconnect structure and method of manufacturing a damascene structure | Yezdi Dordi, John M. Boyd, Fritz Redeker, Tiruchirapalli Arunagiri, Hyungsuk Alexander Yoon | 2011-09-27 |
| 7909934 | Megasonic cleaning efficiency using auto-tuning of a RF generator at constant maximum efficiency | John M. Boyd, Andras Kuthi, Michael G. R. Smith, Thomas W. Anderson | 2011-03-22 |
| 7884017 | Thermal methods for cleaning post-CMP wafers | Zhonghui Wang, Tiruchirapalli Arunagiri, Fritz Redeker, Yezdi Dordi, John M. Boyd +3 more | 2011-02-08 |
| 7875554 | Method for electroless depositing a material on a surface of a wafer | Yezdi Dordi, John M. Boyd, Bob Maraschin, Fred C. Redeker, Joel M. Cook | 2011-01-25 |