Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8048283 | Method and apparatus for plating semiconductor wafers | Yezdi Dordi, John M. Boyd, Fred C. Redeker, Carl Woods | 2011-11-01 |
| 7875554 | Method for electroless depositing a material on a surface of a wafer | Yezdi Dordi, John M. Boyd, William Thie, Fred C. Redeker, Joel M. Cook | 2011-01-25 |