Issued Patents 2011
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8069813 | Wafer electroless plating system and associated methods | William Thie, John M. Boyd, Yezdi Dordi, John Parks, Tiruchirapalli Arunagiri +5 more | 2011-12-06 |
| 8053355 | Methods and systems for low interfacial oxide contact between barrier and copper metallization | John M. Boyd, Yezdi Dordi, Hyungsuk Alexander Yoon, Shijian Li | 2011-11-08 |
| 8034409 | Methods, apparatuses, and systems for fabricating three dimensional integrated circuits | Shijian Li, Yezdi Dordi | 2011-10-11 |
| 8026605 | Interconnect structure and method of manufacturing a damascene structure | Yezdi Dordi, John M. Boyd, William Thie, Tiruchirapalli Arunagiri, Hyungsuk Alexander Yoon | 2011-09-27 |
| 8011116 | Substrate proximity drying using in-situ local heating of substrate | Katrina Mikhaylichenko, Kenneth C. Dodge, Mikhail Korolik, Michael Ravkin, John M. de Larios | 2011-09-06 |
| 7897213 | Methods for contained chemical surface treatment | Katrina Mikhaylichenko, Mike Ravkin, John M. de Larios, Erik M. Freer, Mikhail Korolik | 2011-03-01 |
| 7884017 | Thermal methods for cleaning post-CMP wafers | Zhonghui Wang, Tiruchirapalli Arunagiri, Yezdi Dordi, John M. Boyd, Mikhail Korolik +3 more | 2011-02-08 |
| 7863179 | Methods of fabricating a barrier layer with varying composition for copper metallization | Hyungsuk Alexander Yoon | 2011-01-04 |