Issued Patents 2011
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8058164 | Methods of fabricating electronic devices using direct copper plating | Fritz Redecker | 2011-11-15 |
| 8053355 | Methods and systems for low interfacial oxide contact between barrier and copper metallization | Fritz Redeker, John M. Boyd, Yezdi Dordi, Shijian Li | 2011-11-08 |
| 8026605 | Interconnect structure and method of manufacturing a damascene structure | Yezdi Dordi, John M. Boyd, Fritz Redeker, William Thie, Tiruchirapalli Arunagiri | 2011-09-27 |
| 7863179 | Methods of fabricating a barrier layer with varying composition for copper metallization | Fritz Redeker | 2011-01-04 |