Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8069813 | Wafer electroless plating system and associated methods | William Thie, John M. Boyd, Fritz Redeker, Yezdi Dordi, John Parks +5 more | 2011-12-06 |
| 8026605 | Interconnect structure and method of manufacturing a damascene structure | Yezdi Dordi, John M. Boyd, Fritz Redeker, William Thie, Hyungsuk Alexander Yoon | 2011-09-27 |
| 7884017 | Thermal methods for cleaning post-CMP wafers | Zhonghui Wang, Fritz Redeker, Yezdi Dordi, John M. Boyd, Mikhail Korolik +3 more | 2011-02-08 |