Issued Patents 2004
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6832436 | Method for forming a substructure of a multilayered laminate | Donald O. Anstrom, Bruce J. Chamberlin, James W. Fuller, John M. Lauffer, Douglas O. Powell +2 more | 2004-12-21 |
| 6830875 | Forming a through hole in a photoimageable dielectric structure | Stephen Joseph Fuerniss, Gary Johansson, Ross W. Keesler, John M. Lauffer, Peter A. Moschak +2 more | 2004-12-14 |
| 6828514 | High speed circuit board and method for fabrication | Benson Chan, John M. Lauffer, How T. Lin, David L. Thomas | 2004-12-07 |
| 6826830 | Multi-layered interconnect structure using liquid crystalline polymer dielectric | Frank D. Egitto, Donald S. Farquhar, Mark D. Poliks, Douglas O. Powell | 2004-12-07 |
| 6820332 | Laminate circuit structure and method of fabricating | Robert M. Japp, Konstantinos I. Papathomas | 2004-11-23 |
| 6810583 | Coupling of conductive vias to complex power-signal substructures | Karen Carpenter, David L. Thomas | 2004-11-02 |
| 6809269 | Circuitized substrate assembly and method of making same | James W. Fuller, John M. Lauffer | 2004-10-26 |
| 6788859 | Laminate substrate containing fiber optic cables | Sandeep B. Sane, Sanjeev Sathe | 2004-09-07 |
| 6781064 | Printed circuit boards for electronic device packages having glass free non-conductive layers and method of forming same | Bernd Karl Appelt, Anilkumar C. Bhatt, James W. Fuller, John M. Lauffer, William J. Rudik +1 more | 2004-08-24 |
| 6759270 | Semiconductor chip module and method of manufacture of same | William Infantolino, Sanjeev Sathe, George H. Thiel | 2004-07-06 |
| 6756662 | Semiconductor chip module and method of manufacture of same | William Infantolino, Sanjeev Sathe, George H. Thiel | 2004-06-29 |
| 6753612 | Economical high density chip carrier | Sylvia Adae-Amoakoh, John S. Kresge, Thurston Bryce Youngs, Jr. | 2004-06-22 |
| 6750405 | Two signal one power plane circuit board | Kenneth Michael Fallon, Miguel A. Jimarez, Ross W. Keesler, John M. Lauffer, Roy H. Magnuson +5 more | 2004-06-15 |
| 6740819 | Printed wiring board | Anilkumar C. Bhatt, Ashwinkumar C. Bhatt, Subahu D. Desai, John M. Lauffer, Thomas R. Miller | 2004-05-25 |
| 6739048 | Process of fabricating a circuitized structure | Gerald W. Jones, Ross W. Keesler, William J. Rudik, James Warren Wilson, William E. Wilson | 2004-05-25 |
| 6699350 | Dielectric structure and method of formation | Anilkumar C. Bhatt, Stephen Joseph Fuerniss, Roy H. Magnuson | 2004-03-02 |
| 6695623 | Enhanced electrical/mechanical connection for electronic devices | William L. Brodsky, David V. Caletka, Michael A. Gaynes | 2004-02-24 |
| 6686539 | Tamper-responding encapsulated enclosure having flexible protective mesh structure | Donald S. Farquhar, Claudius Feger, Konstantinos I. Papathomas, Mark D. Poliks, Jane M. Shaw +2 more | 2004-02-03 |
| 6680440 | Circuitized structures produced by the methods of electroless plating | David J. Russell, Gerald W. Jones, Heike Marcello | 2004-01-20 |
| 6678949 | Process for forming a multi-level thin-film electronic packaging structure | Chandrika Prasad, Roy Yu, Richard L. Canull, Giulio DiGiacomo, Ajay P. Giri +6 more | 2004-01-20 |