Issued Patents 2004
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6835589 | Three-dimensional integrated CMOS-MEMS device and process for making the same | H. Bernhard Pogge, Michel Despont, Ute Drechsler, Peter Vettiger, Roy Yu | 2004-12-28 |
| 6737297 | Process for making fine pitch connections between devices and structure made by the process | H. Bernhard Pogge, Roy Yu | 2004-05-18 |
| 6724203 | Full wafer test configuration using memory metals | Lewis S. Goldmann | 2004-04-20 |
| 6678949 | Process for forming a multi-level thin-film electronic packaging structure | Roy Yu, Richard L. Canull, Giulio DiGiacomo, Ajay P. Giri, Lewis S. Goldmann +6 more | 2004-01-20 |