Issued Patents 2004
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6835441 | Bonding together surfaces | Ramesh R. Kodnani | 2004-12-28 |
| 6803256 | Cap attach surface modification for improved adhesion | Stephen L. Buchwalter, Hung Manh Dang, Konstantinos I. Papathomas | 2004-10-12 |
| 6777817 | Reworkable and thermally conductive adhesive and use thereof | Stephen L. Buchwalter, Nancy C. LaBianca, Stefano S. Oggioni, Son K. Tran | 2004-08-17 |
| 6770968 | Method for bonding heat sinks to overmolds and device formed thereby | Frank D. Egitto, Ramesh R. Kodnani, Luis J. Matienzo, Mark V. Pierson | 2004-08-03 |
| 6744132 | Module with adhesively attached heat sink | David J. Alcoe, Thomas W. Dalrymple, Randall J. Stutzman | 2004-06-01 |
| 6740959 | EMI shielding for semiconductor chip carriers | David J. Alcoe, Jeffrey T. Coffin, Harvey C. Hamel, Mario J. Interrante, Brenda Peterson +6 more | 2004-05-25 |
| 6739046 | Method for producing dendrite interconnect for planarization | Bernd Karl Appelt, Saswati Datta, John M. Lauffer, James R. Wilcox | 2004-05-25 |
| 6719871 | Method for bonding heat sinks to overmolds and device formed thereby | Frank D. Egitto, Ramesh R. Kodnani, Luis J. Matienzo, Mark V. Pierson | 2004-04-13 |
| 6695623 | Enhanced electrical/mechanical connection for electronic devices | William L. Brodsky, David V. Caletka, Voya R. Markovich | 2004-02-24 |