Issued Patents 2004
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6820332 | Laminate circuit structure and method of fabricating | Robert M. Japp, Voya R. Markovich | 2004-11-23 |
| 6803256 | Cap attach surface modification for improved adhesion | Stephen L. Buchwalter, Hung Manh Dang, Michael A. Gaynes | 2004-10-12 |
| 6794040 | Flowable compositions and use in filling vias and plated through-holes | Gary Johansson | 2004-09-21 |
| 6790473 | Lead protective coating composition, process and structure thereof | Stephen Joseph Fuerniss, Deborah L. Dittrich, David W. Wang | 2004-09-14 |
| 6739027 | Method for producing printed circuit board with embedded decoupling capacitance | John M. Lauffer | 2004-05-25 |
| 6734569 | Die attachment with reduced adhesive bleed-out | Bernd Karl Appelt, Gary Johansson | 2004-05-11 |
| 6734259 | Resin composition with a polymerizing agent and method of manufacturing prepreg and other laminate structures therefrom | Robert M. Japp, Cory J. Ruud | 2004-05-11 |
| 6700078 | Formation of multisegmented plated through holes | Donald S. Farquhar, Robert M. Japp, John M. Lauffer | 2004-03-02 |
| 6686539 | Tamper-responding encapsulated enclosure having flexible protective mesh structure | Donald S. Farquhar, Claudius Feger, Voya R. Markovich, Mark D. Poliks, Jane M. Shaw +2 more | 2004-02-03 |