Issued Patents 2004
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6826830 | Multi-layered interconnect structure using liquid crystalline polymer dielectric | Frank D. Egitto, Donald S. Farquhar, Voya R. Markovich, Douglas O. Powell | 2004-12-07 |
| 6819373 | Lamination of liquid crystal polymer dielectric films | Donald S. Farquhar | 2004-11-16 |
| 6722031 | Method for making printed circuit board having low coefficient of thermal expansion power/ground plane | Robert M. Japp | 2004-04-20 |
| 6686539 | Tamper-responding encapsulated enclosure having flexible protective mesh structure | Donald S. Farquhar, Claudius Feger, Voya R. Markovich, Konstantinos I. Papathomas, Jane M. Shaw +2 more | 2004-02-03 |