Issued Patents 2004
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6826830 | Multi-layered interconnect structure using liquid crystalline polymer dielectric | Donald S. Farquhar, Voya R. Markovich, Mark D. Poliks, Douglas O. Powell | 2004-12-07 |
| 6822332 | Fine line circuitization | Kevin Knadle, Andrew Seman | 2004-11-23 |
| 6790305 | Method and structure for small pitch z-axis electrical interconnections | Brian E. Curcio, Robert M. Japp, Thomas R. Miller, Manh-Quan Nguyen, Douglas O. Powell | 2004-09-14 |
| 6770968 | Method for bonding heat sinks to overmolds and device formed thereby | Michael A. Gaynes, Ramesh R. Kodnani, Luis J. Matienzo, Mark V. Pierson | 2004-08-03 |
| 6719871 | Method for bonding heat sinks to overmolds and device formed thereby | Michael A. Gaynes, Ramesh R. Kodnani, Luis J. Matienzo, Mark V. Pierson | 2004-04-13 |