Issued Patents 2004
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6836015 | Optical assemblies for transmitting and manipulating optical beams | Monty M. Denneau, Dinesh Gupta, Lisa J. Jimarez, Steven P. Ostrander, Brenda Peterson +2 more | 2004-12-28 |
| 6805280 | Z interconnect structure and method | Lisa J. Jimarez | 2004-10-19 |
| 6774472 | Panel structure with plurality of chip compartments for providing high volume of chip modules | — | 2004-08-10 |
| 6774315 | Floating interposer | Jennifer Sweterlitsch, Charles G. Woychik, Thurston Bryce Youngs, Jr. | 2004-08-10 |
| 6770968 | Method for bonding heat sinks to overmolds and device formed thereby | Frank D. Egitto, Michael A. Gaynes, Ramesh R. Kodnani, Luis J. Matienzo | 2004-08-03 |
| 6759738 | Systems interconnected by bumps of joining material | Kenneth Michael Fallon, Christian Robert Le Coz | 2004-07-06 |
| 6756680 | Flip chip C4 extension structure and process | Miguel A. Jimarez, Cynthia S. Milkovich | 2004-06-29 |
| 6719871 | Method for bonding heat sinks to overmolds and device formed thereby | Frank D. Egitto, Michael A. Gaynes, Ramesh R. Kodnani, Luis J. Matienzo | 2004-04-13 |
| 6708871 | Method for forming solder connections on a circuitized substrate | — | 2004-03-23 |
| 6699736 | Electrical coupling of a stiffener to a chip carrier | Terry J. Dornbos, Raymond Phillips, William J. Rudik, David L. Thomas | 2004-03-02 |
| 6674647 | Low or no-force bump flattening structure and method | Ajit K. Trivedi | 2004-01-06 |