Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6829149 | Placement of sacrificial solder balls underneath the PBGA substrate | Chi-Shih Chang, William T. Chen | 2004-12-07 |
| 6674647 | Low or no-force bump flattening structure and method | Mark V. Pierson | 2004-01-06 |