Issued Patents 2004
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6770968 | Method for bonding heat sinks to overmolds and device formed thereby | Frank D. Egitto, Michael A. Gaynes, Ramesh R. Kodnani, Mark V. Pierson | 2004-08-03 |
| 6759597 | Wire bonding to dual metal covered pad surfaces | Lawrence R. Cutting, John G. Gaudiello, Nikhil M. Murdeshwar | 2004-07-06 |
| 6730409 | Promoting adhesion between a polymer and a metallic substrate | Anastasios Angelopoulos, Stephen Joseph Fuerniss, Joseph Alphonse Kotylo, Norman L. Shaver | 2004-05-04 |
| 6719871 | Method for bonding heat sinks to overmolds and device formed thereby | Frank D. Egitto, Michael A. Gaynes, Ramesh R. Kodnani, Mark V. Pierson | 2004-04-13 |
| 6713858 | Flip-chip package with optimized encapsulant adhesion and method | Ramesh R. Kodnani, Son K. Tran | 2004-03-30 |
| 6693031 | Formation of a metallic interlocking structure | Gerald G. Advocate, Jr., Francis J. Downes, Jr., Ronald A. Kaschak, John S. Kresge, Daniel C. Van Hart | 2004-02-17 |