Issued Patents 2004
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6835441 | Bonding together surfaces | Michael A. Gaynes | 2004-12-28 |
| 6770968 | Method for bonding heat sinks to overmolds and device formed thereby | Frank D. Egitto, Michael A. Gaynes, Luis J. Matienzo, Mark V. Pierson | 2004-08-03 |
| 6719871 | Method for bonding heat sinks to overmolds and device formed thereby | Frank D. Egitto, Michael A. Gaynes, Luis J. Matienzo, Mark V. Pierson | 2004-04-13 |
| 6713858 | Flip-chip package with optimized encapsulant adhesion and method | Luis J. Matienzo, Son K. Tran | 2004-03-30 |