Issued Patents 2004
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6777817 | Reworkable and thermally conductive adhesive and use thereof | Stephen L. Buchwalter, Michael A. Gaynes, Nancy C. LaBianca, Stefano S. Oggioni | 2004-08-17 |
| 6739497 | SMT passive device noflow underfill methodology and structure | Clement Fortin, Pierre Langevin, Michael B. Vincent | 2004-05-25 |
| 6713858 | Flip-chip package with optimized encapsulant adhesion and method | Ramesh R. Kodnani, Luis J. Matienzo | 2004-03-30 |