Issued Patents 2004
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6815258 | Flip-chip package with underfill having low density filler | — | 2004-11-09 |
| 6739497 | SMT passive device noflow underfill methodology and structure | Clement Fortin, Pierre Langevin, Son K. Tran | 2004-05-25 |
| 6674172 | Flip-chip package with underfill having low density filler | — | 2004-01-06 |