Issued Patents 2004
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6834426 | Method of fabricating a laminate circuit structure | Robert M. Japp, Gregory Kevern | 2004-12-28 |
| 6781064 | Printed circuit boards for electronic device packages having glass free non-conductive layers and method of forming same | Bernd Karl Appelt, Anilkumar C. Bhatt, James W. Fuller, John M. Lauffer, Voya R. Markovich +1 more | 2004-08-24 |
| 6739048 | Process of fabricating a circuitized structure | Gerald W. Jones, Ross W. Keesler, Voya R. Markovich, James Warren Wilson, William E. Wilson | 2004-05-25 |
| 6699736 | Electrical coupling of a stiffener to a chip carrier | Terry J. Dornbos, Raymond Phillips, Mark V. Pierson, David L. Thomas | 2004-03-02 |