Issued Patents 2004
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6815085 | Printed circuit board capacitor structure and method | John M. Lauffer | 2004-11-09 |
| 6781064 | Printed circuit boards for electronic device packages having glass free non-conductive layers and method of forming same | Anilkumar C. Bhatt, James W. Fuller, John M. Lauffer, Voya R. Markovich, William J. Rudik +1 more | 2004-08-24 |
| 6739046 | Method for producing dendrite interconnect for planarization | Saswati Datta, Michael A. Gaynes, John M. Lauffer, James R. Wilcox | 2004-05-25 |
| 6734569 | Die attachment with reduced adhesive bleed-out | Gary Johansson, Konstantinos I. Papathomas | 2004-05-11 |
| 6684497 | Manufacturing methods for printed circuit boards | James R. Bupp, Donald S. Farquhar, Ross W. Keesler, Michael Joseph Klodowski, Andrew Seman +1 more | 2004-02-03 |