Issued Patents 2004
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6829823 | Method of making a multi-layered interconnect structure | Francis J. Downes, Jr., Elizabeth Foster, Robert M. Japp, Gerald W. Jones, John S. Kresge +3 more | 2004-12-14 |
| 6826830 | Multi-layered interconnect structure using liquid crystalline polymer dielectric | Frank D. Egitto, Voya R. Markovich, Mark D. Poliks, Douglas O. Powell | 2004-12-07 |
| 6819373 | Lamination of liquid crystal polymer dielectric films | Mark D. Poliks | 2004-11-16 |
| 6776852 | Process of removing holefill residue from a metallic surface of an electronic substrate | Christina M. Boyko, Brian E. Curcio, Michael Wozniak | 2004-08-17 |
| 6764748 | Z-interconnections with liquid crystal polymer dielectric films | Douglas O. Powell | 2004-07-20 |
| 6700078 | Formation of multisegmented plated through holes | Robert M. Japp, John M. Lauffer, Konstantinos I. Papathomas | 2004-03-02 |
| 6686539 | Tamper-responding encapsulated enclosure having flexible protective mesh structure | Claudius Feger, Voya R. Markovich, Konstantinos I. Papathomas, Mark D. Poliks, Jane M. Shaw +2 more | 2004-02-03 |
| 6684497 | Manufacturing methods for printed circuit boards | Bernd Karl Appelt, James R. Bupp, Ross W. Keesler, Michael Joseph Klodowski, Andrew Seman +1 more | 2004-02-03 |
| 6675852 | Platen for use in laminating press | Varaprasad V. Calmidi, Michael Joseph Klodowski, Randall J. Stutzman | 2004-01-13 |