Issued Patents 2004
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6830960 | Stress-relieving heatsink structure and method of attachment to an electronic package | David J. Alcoe | 2004-12-14 |
| 6829144 | Flip chip package with heat spreader allowing multiple heat sink attachment | Jamil A. Wakil | 2004-12-07 |
| 6793123 | Packaging for multi-processor shared-memory system | Harm Peter Hofstee, Eric A. Johnson, Jamil A. Wakil | 2004-09-21 |
| 6744132 | Module with adhesively attached heat sink | David J. Alcoe, Thomas W. Dalrymple, Michael A. Gaynes | 2004-06-01 |
| 6740959 | EMI shielding for semiconductor chip carriers | David J. Alcoe, Jeffrey T. Coffin, Michael A. Gaynes, Harvey C. Hamel, Mario J. Interrante +6 more | 2004-05-25 |
| 6691769 | Heat sink for convection cooling in horizontal applications | Eric A. Johnson | 2004-02-17 |
| 6675852 | Platen for use in laminating press | Varaprasad V. Calmidi, Donald S. Farquhar, Michael Joseph Klodowski | 2004-01-13 |