TD

Thomas W. Dalrymple

IBM: 1 patents #1,866 of 5,464Top 35%
📍 Endicott, NY: #31 of 69 inventorsTop 45%
🗺 New York: #2,888 of 9,035 inventorsTop 35%
Overall (2004): #102,108 of 270,089Top 40%
1
Patents 2004

Issued Patents 2004

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6744132 Module with adhesively attached heat sink David J. Alcoe, Michael A. Gaynes, Randall J. Stutzman 2004-06-01