Issued Patents 2004
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6830960 | Stress-relieving heatsink structure and method of attachment to an electronic package | Randall J. Stutzman | 2004-12-14 |
| 6815837 | Electronic package with strengthened conductive pad | — | 2004-11-09 |
| 6816385 | Compliant laminate connector | — | 2004-11-09 |
| 6744132 | Module with adhesively attached heat sink | Thomas W. Dalrymple, Michael A. Gaynes, Randall J. Stutzman | 2004-06-01 |
| 6740959 | EMI shielding for semiconductor chip carriers | Jeffrey T. Coffin, Michael A. Gaynes, Harvey C. Hamel, Mario J. Interrante, Brenda Peterson +6 more | 2004-05-25 |
| 6720502 | Integrated circuit structure | Francis J. Downes, Jr., Gerald W. Jones, John S. Kresge, Cheryl L. Tytran-Palomaki | 2004-04-13 |
| 6703704 | Stress reducing stiffener ring | Kim J. Blackwell, Virendra R. Jadhav | 2004-03-09 |