Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6829144 | Flip chip package with heat spreader allowing multiple heat sink attachment | Randall J. Stutzman | 2004-12-07 |
| 6793123 | Packaging for multi-processor shared-memory system | Harm Peter Hofstee, Eric A. Johnson, Randall J. Stutzman | 2004-09-21 |