JF

James W. Fuller

IBM: 2 patents #982 of 5,464Top 20%
ET Endicott Interconnect Technologies: 1 patents #3 of 7Top 45%
📍 Amston, CT: #3 of 7 inventorsTop 45%
🗺 Connecticut: #153 of 2,707 inventorsTop 6%
Overall (2004): #27,583 of 270,089Top 15%
3
Patents 2004

Issued Patents 2004

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
6832436 Method for forming a substructure of a multilayered laminate Donald O. Anstrom, Bruce J. Chamberlin, John M. Lauffer, Voya R. Markovich, Douglas O. Powell +2 more 2004-12-21
6809269 Circuitized substrate assembly and method of making same John M. Lauffer, Voya R. Markovich 2004-10-26
6781064 Printed circuit boards for electronic device packages having glass free non-conductive layers and method of forming same Bernd Karl Appelt, Anilkumar C. Bhatt, John M. Lauffer, Voya R. Markovich, William J. Rudik +1 more 2004-08-24