Issued Patents 2004
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6774474 | Partially captured oriented interconnections for BGA packages and a method of forming the interconnections | Eric A. Johnson | 2004-08-10 |
| 6695623 | Enhanced electrical/mechanical connection for electronic devices | William L. Brodsky, Michael A. Gaynes, Voya R. Markovich | 2004-02-24 |
| 6686664 | Structure to accommodate increase in volume expansion during solder reflow | Krishna Darbha, Donald W. Henderson, Lawrence P. Lehman, George H. Thiel | 2004-02-03 |
| 6672500 | Method for producing a reliable solder joint interconnection | Kevin Knadle, Charles G. Woychik | 2004-01-06 |