Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6805974 | Lead-free tin-silver-copper alloy solder composition | Won Kook Choi, Charles C. Goldsmith, Timothy A. Gosselin, Sung Kwon Kang, Karl J. Puttlitz +1 more | 2004-10-19 |
| 6686664 | Structure to accommodate increase in volume expansion during solder reflow | David V. Caletka, Krishna Darbha, Lawrence P. Lehman, George H. Thiel | 2004-02-03 |