Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6818988 | Method of making a circuitized substrate and the resultant circuitized substrate | Donald I. Mead | 2004-11-16 |
| 6805974 | Lead-free tin-silver-copper alloy solder composition | Won Kook Choi, Charles C. Goldsmith, Donald W. Henderson, Sung Kwon Kang, Karl J. Puttlitz +1 more | 2004-10-19 |