Issued Patents 2004
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6805974 | Lead-free tin-silver-copper alloy solder composition | Won Kook Choi, Charles C. Goldsmith, Timothy A. Gosselin, Donald W. Henderson, Karl J. Puttlitz +1 more | 2004-10-19 |
| 6784088 | Method to selectively cap interconnects with indium or tin bronzes and/or oxides thereof and the interconnect so capped | Daniel C. Edelstein, Maurice McGlashan-Powell, Eugene J. O'Sullivan, George F. Walker | 2004-08-31 |
| 6698077 | Display fabrication using modular active devices | Stephen L. Buchwalter, Evan G. Colgan, Robert L. Wisnieff | 2004-03-02 |