Issued Patents 2004
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6784088 | Method to selectively cap interconnects with indium or tin bronzes and/or oxides thereof and the interconnect so capped | Sung Kwon Kang, Maurice McGlashan-Powell, Eugene J. O'Sullivan, George F. Walker | 2004-08-31 |
| 6779711 | Self-aligned corrosion stop for copper C4 and wirebond | Anthony K. Stamper, Judith M. Rubino, Carlos J. Sambucetti | 2004-08-24 |
| 6777809 | BEOL decoupling capacitor | Peter Richard Duncombe, Robert Benjamin Laibowitz, Deborah A. Neumayer, Tak H. Ning, Robert Rosenberg +1 more | 2004-08-17 |
| 6746947 | Post-fuse blow corrosion prevention structure for copper fuses | Timothy H. Daubenspeck, Robert M. Geffken, William T. Motsiff, Anthony K. Stamper, Steven H. Voldman | 2004-06-08 |
| 6743268 | Chemical-mechanical planarization of barriers or liners for copper metallurgy | William J. Cote, Naftali E. Lustig | 2004-06-01 |
| 6740539 | Carbon-graded layer for improved adhesion of low-k dielectrics to silicon substrates | Richard A. Conti, Prakash Dev, David M. Dobuzinsky, Gill Yong Lee, Kia-Seng Low +3 more | 2004-05-25 |
| 6730984 | Increasing an electrical resistance of a resistor by oxidation or nitridization | Arne Ballantine, Anthony K. Stamper | 2004-05-04 |
| 6709562 | Method of making electroplated interconnection structures on integrated circuit chips | Panayotis Andricacos, Hariklia Deligianni, John O. Dukovic, Wilma Jean Horkans, Chao-Kun Hu +4 more | 2004-03-23 |