Issued Patents 2004
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6819000 | High density area array solder microjoining interconnect structure and fabrication method | John Harold Magerlein, Kevin S. Petrarca, Sampath Purushothaman, Richard P. Volant, George F. Walker | 2004-11-16 |
| 6779711 | Self-aligned corrosion stop for copper C4 and wirebond | Daniel C. Edelstein, Anthony K. Stamper, Judith M. Rubino | 2004-08-24 |
| 6747472 | Temporary device attach structure for test and burn in of microjoint interconnects and method for fabricating the same | John Harold Magerlein, Samuel McKnight, Kevin S. Petrarca, Sampath Purushothaman, Joseph J. Van Horn +2 more | 2004-06-08 |
| 6732908 | High density raised stud microjoining system and methods of fabricating the same | Bruce K. Furman, Maheswaran Surendra, Sherif A. Goma, Simon Karecki, John Harold Magerlein +4 more | 2004-05-11 |