Issued Patents 2004
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6831366 | Interconnects containing first and second porous low-k dielectrics separated by a porous buried etch stop layer | Stephen M. Gates, Jeffrey Hedrick, Satyanarayana V. Nitta, Cristy Sensenich Tyberg | 2004-12-14 |
| 6831364 | Method for forming a porous dielectric material layer in a semiconductor device and device formed | Timothy J. Dalton, Stephen E. Greco, Jeffrey Hedrick, Satyanarayana V. Nitta, Kenneth P. Rodbell +1 more | 2004-12-14 |
| 6819000 | High density area array solder microjoining interconnect structure and fabrication method | John Harold Magerlein, Kevin S. Petrarca, Carlos J. Sambucetti, Richard P. Volant, George F. Walker | 2004-11-16 |
| 6815329 | Multilayer interconnect structure containing air gaps and method for making | Katherina Babich, Roy A. Carruthers, Timothy J. Dalton, Alfred Grill, Jeffrey Hedrick +4 more | 2004-11-09 |
| 6784485 | Diffusion barrier layer and semiconductor device containing same | Stephan A. Cohen, Timothy J. Dalton, John A. Fitzsimmons, Stephen M. Gates, Lynne M. Gignac +5 more | 2004-08-31 |
| 6780499 | Ordered two-phase dielectric film, and semiconductor device containing the same | Stephen M. Gates, Christopher B. Murray, Satyanarayana V. Nitta | 2004-08-24 |
| 6759321 | Stabilization of fluorine-containing low-k dielectrics in a metal/insulator wiring structure by ultraviolet irradiation | Katherina Babich, Alessandro C. Callegari, Stephen A. Cohen, Alfred Grill, Christopher V. Jahnes +2 more | 2004-07-06 |
| 6747472 | Temporary device attach structure for test and burn in of microjoint interconnects and method for fabricating the same | John Harold Magerlein, Samuel McKnight, Kevin S. Petrarca, Carlos J. Sambucetti, Joseph J. Van Horn +2 more | 2004-06-08 |
| 6737725 | Multilevel interconnect structure containing air gaps and method for making | Alfred Grill, Jeffrey Hedrick, Christopher V. Jahnes, Satyanarayana V. Nitta, Kevin S. Petrarca +2 more | 2004-05-18 |
| 6732908 | High density raised stud microjoining system and methods of fabricating the same | Bruce K. Furman, Maheswaran Surendra, Sherif A. Goma, Simon Karecki, John Harold Magerlein +4 more | 2004-05-11 |
| 6726996 | Laminated diffusion barrier | Edward Barth, Stephan A. Cohen, Chester T. Dziobkowski, John A. Fitzsimmons, Stephen M. Gates +3 more | 2004-04-27 |
| 6724069 | Spin-on cap layer, and semiconductor device containing same | Timothy J. Dalton, Stephen M. Gates, Jeffrey Hedrick, Satyanarayana V. Nitta, Christy S. Tyberg | 2004-04-20 |
| 6720249 | Protective hardmask for producing interconnect structures | Timothy J. Dalton, Christopher V. Jahnes, Joyce C. Liu | 2004-04-13 |
| 6716742 | Low-k interconnect structure comprised of a multilayer of spin-on porous dielectrics | Stephen M. Gates, Jeffrey Hedrick, Satyanarayana V. Nitta, Cristy Sensenich Tyberg | 2004-04-06 |
| 6710450 | Interconnect structure with precise conductor resistance and method to form same | Stephen M. Gates, Jeffrey Hedrick, Satyanarayana V. Nitta, Cristy Sensenich Tyberg | 2004-03-23 |
| 6682786 | Liquid crystal display cell having liquid crystal molecules in vertical or substantially vertical alignment | Shui-Chih Lien, Alessandro C. Callegari, Paul S. Andry, Praveen Chaudhari, James A. Lacey +6 more | 2004-01-27 |
| 6678949 | Process for forming a multi-level thin-film electronic packaging structure | Chandrika Prasad, Roy Yu, Richard L. Canull, Giulio DiGiacomo, Ajay P. Giri +6 more | 2004-01-20 |
| 6677680 | Hybrid low-k interconnect structure comprised of 2 spin-on dielectric materials | Stephen M. Gates, Jeffrey Hedrick, Satyanarayana V. Nitta, Cristy Sensenich Tyberg | 2004-01-13 |