Issued Patents 2004
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6818285 | Composition and method to achieve reduced thermal expansion in polyarylene networks | Jeffrey Hedrick, Muthumanickam Sankarapandian, James P. Godschalx, Qingshan Jason Niu, Harry Craig Silvis | 2004-11-16 |
| 6783862 | Toughness, adhesion and smooth metal lines of porous low k dielectric interconnect structures | Jeffrey Hedrick, Kang-Wook Lee, Kelly Malone | 2004-08-31 |
| 6724069 | Spin-on cap layer, and semiconductor device containing same | Timothy J. Dalton, Stephen M. Gates, Jeffrey Hedrick, Satyanarayana V. Nitta, Sampath Purushothaman | 2004-04-20 |
| 6674168 | Single and multilevel rework | Edward C. Cooney, III, Robert M. Geffken, Vincent J. McGahay, William T. Motsiff, Mark P. Murray +4 more | 2004-01-06 |