Issued Patents 2004
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6831363 | Structure and method for reducing thermo-mechanical stress in stacked vias | Timothy J. Dalton, Sanjit Das, Brett H. Engel, Brian Herbst, Habib Hichri +8 more | 2004-12-14 |
| 6783862 | Toughness, adhesion and smooth metal lines of porous low k dielectric interconnect structures | Jeffrey Hedrick, Kang-Wook Lee, Christy S. Tyberg | 2004-08-31 |
| 6764873 | Semiconductor wafer including a low dielectric constant thermosetting polymer film and method of making same | Habib Hichri, Arthur Winston Martin | 2004-07-20 |