Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6831363 | Structure and method for reducing thermo-mechanical stress in stacked vias | Timothy J. Dalton, Sanjit Das, Brian Herbst, Habib Hichri, Bernd Kastenmeier +8 more | 2004-12-14 |
| 6734090 | Method of making an edge seal for a semiconductor device | Birendra Agarwala, Hormazdyar M. Dalal, Eric G. Liniger, Diana Llera-Hurlburt, Du Nguyen +3 more | 2004-05-11 |