BH

Brian Herbst

IBM: 1 patents #1,866 of 5,464Top 35%
📍 Beekman, NY: #1 of 3 inventorsTop 35%
🗺 New York: #2,888 of 9,035 inventorsTop 35%
Overall (2004): #252,980 of 270,089Top 95%
1
Patents 2004

Issued Patents 2004

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6831363 Structure and method for reducing thermo-mechanical stress in stacked vias Timothy J. Dalton, Sanjit Das, Brett H. Engel, Habib Hichri, Bernd Kastenmeier +8 more 2004-12-14