BA

Birendra Agarwala

IBM: 2 patents #982 of 5,464Top 20%
📍 Wappingers Falls, NY: #36 of 138 inventorsTop 30%
🗺 New York: #1,410 of 9,035 inventorsTop 20%
Overall (2004): #71,870 of 270,089Top 30%
2
Patents 2004

Issued Patents 2004

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
6825561 Structure and method for eliminating time dependent dielectric breakdown failure of low-k material Du Nguyen, Hazara S. Rathore 2004-11-30
6734090 Method of making an edge seal for a semiconductor device Hormazdyar M. Dalal, Eric G. Liniger, Diana Llera-Hurlburt, Du Nguyen, Richard W. Procter +3 more 2004-05-11