KL

Kang-Wook Lee

IBM: 2 patents #982 of 5,464Top 20%
📍 Yongin-si, NY: #2 of 6 inventorsTop 35%
Overall (2004): #56,107 of 270,089Top 25%
2
Patents 2004

Issued Patents 2004

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
6783862 Toughness, adhesion and smooth metal lines of porous low k dielectric interconnect structures Jeffrey Hedrick, Kelly Malone, Christy S. Tyberg 2004-08-31
6784485 Diffusion barrier layer and semiconductor device containing same Stephan A. Cohen, Timothy J. Dalton, John A. Fitzsimmons, Stephen M. Gates, Lynne M. Gignac +5 more 2004-08-31