Issued Patents 2004
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6831363 | Structure and method for reducing thermo-mechanical stress in stacked vias | Timothy J. Dalton, Sanjit Das, Brett H. Engel, Brian Herbst, Habib Hichri +8 more | 2004-12-14 |
| 6821890 | Method for improving adhesion to copper | Thomas Ivers, Joyce C. Liu, Henry A. Nye, III | 2004-11-23 |
| 6737747 | Advanced BEOL interconnect structures with low-k PE CVD cap layer and method thereof | Edward Barth, John A. Fitzsimmons, Stephen M. Gates, Thomas Ivers, Sarah L. Lane +3 more | 2004-05-18 |
| 6727589 | Dual damascene flowable oxide insulation structure and metallic barrier | Stephen E. Greco, John P. Hummel, Joyce C. Liu, Rebecca D. Mih, Kamalesh K. Srivastava | 2004-04-27 |
| 6674168 | Single and multilevel rework | Edward C. Cooney, III, Robert M. Geffken, William T. Motsiff, Mark P. Murray, Amanda Piper +4 more | 2004-01-06 |