Issued Patents 2004
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6835973 | Antifuse for use with low &kgr; dielectric foam insulators | Timothy H. Daubenspeck, William A. Klaasen, Rosemary A. Previti-Kelly, Jed H. Rankin | 2004-12-28 |
| 6827868 | Thinning of fuse passivation after C4 formation | Timothy H. Daubenspeck, Jeffrey P. Gambino | 2004-12-07 |
| 6815838 | Laser alignment target and method | Timothy H. Daubenspeck, Richard A. Gilmour, Christopher D. Muzzy | 2004-11-09 |
| 6806578 | Copper pad structure | Wayne J. Howell, Ronald L. Mendelson | 2004-10-19 |
| 6798066 | Heat dissipation from IC interconnects | Timothy D. Sullivan, Jean Wynne, Sally J. Yankee | 2004-09-28 |
| 6784516 | Insulative cap for laser fusing | Timothy H. Daubenspeck, Thomas L. McDevitt, Henry A. Nye, III | 2004-08-31 |
| 6773952 | Semiconductor chip structures with embedded thermal conductors and a thermal sink disposed over opposing substrate surfaces | Douglas S. Armbrust, William F. Clark, Jr., William A. Klaasen, Timothy D. Sullivan | 2004-08-10 |
| 6746947 | Post-fuse blow corrosion prevention structure for copper fuses | Timothy H. Daubenspeck, Daniel C. Edelstein, Robert M. Geffken, Anthony K. Stamper, Steven H. Voldman | 2004-06-08 |
| 6743710 | Stacked fill structures for support of dielectric layers | Timothy G. Dunham, Howard S. Landis | 2004-06-01 |
| 6734047 | Thinning of fuse passivation after C4 formation | Timothy H. Daubenspeck, Jeffrey P. Gambino | 2004-05-11 |
| 6713838 | Inductive fuse for semiconductor device | Wilbur D. Pricer, Rosemary A. Previti-Kelly | 2004-03-30 |
| 6674168 | Single and multilevel rework | Edward C. Cooney, III, Robert M. Geffken, Vincent J. McGahay, Mark P. Murray, Amanda Piper +4 more | 2004-01-06 |