DA

Douglas S. Armbrust

IBM: 2 patents #982 of 5,464Top 20%
📍 Colchester, VT: #14 of 60 inventorsTop 25%
🗺 Vermont: #95 of 538 inventorsTop 20%
Overall (2004): #67,178 of 270,089Top 25%
2
Patents 2004

Issued Patents 2004

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
6818992 Self-aligned copper silicide formation for improved adhesion/electromigration Margaret L. Gibson, Laura Serianni, Eric J. White 2004-11-16
6773952 Semiconductor chip structures with embedded thermal conductors and a thermal sink disposed over opposing substrate surfaces William F. Clark, Jr., William A. Klaasen, William T. Motsiff, Timothy D. Sullivan 2004-08-10