Issued Patents 2004
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6805974 | Lead-free tin-silver-copper alloy solder composition | Won Kook Choi, Charles C. Goldsmith, Timothy A. Gosselin, Donald W. Henderson, Sung Kwon Kang +1 more | 2004-10-19 |
| 6746770 | Electrically conductive and abrasion/scratch resistant polymeric materials, method of fabrication thereof and uses thereof | Ali Afzali-Ardakani, Marie Angelopoulos, Jack A. Dickerson, Thomas Baird Pillsbury, Jane M. Shaw +1 more | 2004-06-08 |
| 6703560 | Stress resistant land grid array (LGA) module and method of forming the same | Patrick A. Coico, James H. Covell, Benjamin V. Fasano, Lewis S. Goldman, Ronald L. Hering +4 more | 2004-03-09 |