CG

Charles C. Goldsmith

IBM: 1 patents #1,866 of 5,464Top 35%
📍 Hopewell Junction, NY: #48 of 103 inventorsTop 50%
🗺 New York: #2,888 of 9,035 inventorsTop 35%
Overall (2004): #248,098 of 270,089Top 95%
1
Patents 2004

Issued Patents 2004

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6805974 Lead-free tin-silver-copper alloy solder composition Won Kook Choi, Timothy A. Gosselin, Donald W. Henderson, Sung Kwon Kang, Karl J. Puttlitz +1 more 2004-10-19