KD

Krishna Darbha

IBM: 1 patents #1,866 of 5,464Top 35%
📍 Kirkland, WA: #46 of 171 inventorsTop 30%
🗺 Washington: #1,078 of 4,011 inventorsTop 30%
Overall (2004): #172,784 of 270,089Top 65%
1
Patents 2004

Issued Patents 2004

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6686664 Structure to accommodate increase in volume expansion during solder reflow David V. Caletka, Donald W. Henderson, Lawrence P. Lehman, George H. Thiel 2004-02-03